AI Compute Infrastructure
Dagmont Compute Systems
High-density AI compute infrastructure engineered across rack systems, liquid cooling, power, server integration, networking, and validation.
Engineering & Integration
Dagmont Compute Systems engineers and integrates high-density AI infrastructure: rack layout, liquid cooling, power distribution, server integration, networking, and system validation.
Each project starts with the customer’s technical requirements. Component selection, electrical approvals, and performance targets are confirmed before a delivery scope is agreed.
Rack Systems
High-density server racks, OCP-compatible enclosures, mechanical integration, and rack-scale systems.
Rack engineering covers EIA and OCP-style frames, cable and hose routing, installation constraints, and rack-scale mechanical integration. Enclosure specifications and sourcing are established for each project.
Liquid Cooling
Direct-to-chip cooling, coolant distribution units, manifolds, cold plates, cooling connections, and leak detection.
Liquid cooling engineering covers direct-to-chip architectures, in-rack coolant distribution, manifolds, connections, and leak detection. Cooling capacity and thermal validation are defined against the requirements of each project.
Power Systems
Rack power distribution, intelligent PDUs, power shelves, busbars, and related electrical integration.
Rack power engineering covers PDU selection, power shelves, busbars, electrical layout, and power distribution integration. Ratings, applicable safety standards, and installation requirements are reviewed for each configuration.
Server Integration
Integration of compatible third-party GPU servers, compute trays, accelerator platforms, and supporting hardware.
Server integration covers compatible third-party compute trays, GPU servers, and accelerator platforms. Component sourcing, platform compatibility, and rack-level assembly requirements are confirmed for each system.
Networking & Connectivity
High-speed switching, optical connectivity, cabling, and network integration.
Networking integration covers high-speed switching layouts, optical connections, cable management, labeling, and connectivity verification within the rack or row.
Testing & Validation
Electrical testing, thermal testing, cooling-loop pressure and leak testing, burn-in, performance verification, and customer acceptance.
Project-specific validation plans cover electrical safety, cooling-loop integrity, thermal performance, system burn-in, and acceptance testing. Results are documented against the agreed configuration and customer requirements.
Discuss your compute requirements
Submit rack density, cooling architecture, power requirements, integration scope, quantities, and delivery location. Dagmont reviews the specifications and sets the engineering, sourcing, and validation requirements for the project.
For technical inquiries, contact [email protected].